The Huawei’s HiSilicon Kirin 970 beats the Qualcomm‘s latest Snapdragon 845 on synthetic benchmarks by approximately 7%, according to Chinese social media platform Weibo. The Kirin 970 is the world’s first AI SoC, Qualcomm’s Snapdragon 845 also places a large focus on AI.
The difference between the two isn’t massive and is possibly even smaller than the newly uncovered results suggest seeing how they only show a couple of individual tests and not the average of a larger number of results. Likewise, synthetic benchmark scores are hardly indicative of real-world performance, especially in the context of such small margins.
With hardware only being part of the equation, it’s up to original equipment manufacturers to optimize their smartphones and the software running on them in a manner that takes maximum advantage of their silicon of choice.
The semiconductor industry still won’t be moving away from the 10nm process node in 2018 but a jump to the 7nm technology is expected in early 2019, being pioneered by TSMC that’s also said to be the manufacturer of the Snapdragon 855 and replace Samsung as Qualcomm’s chip partner.