Samsung will keep using heat pipes in Galaxy S9 & Note 9

According to the new report, Samsung will reportedly continue to use heat pipes with its 2018 major smartphone releases. Samsung adopted heat pipes with the Galaxy S7 and has used them for cooling on S and Note flagships since.

According to a new report out of DigiTimes which in turn credits “sources from upstream supply chain” for the information. While also noting how suppliers of these heat pipes have already started production on the parts.

This is following on from rumors which have suggested Samsung might not include heat pipes in its upcoming phones next year. The main reason given for this is that they just are too expensive for what they are.

Because of their high prices, heat pipes so far are not a popular thermal solution among smartphone vendors and are mainly used only in flagship models. However, due to the fundamental nature of heat pipes acting as an additional measure to stop a smartphone from overheating, some alternative form of cooling would need to be in place instead.

Samsung will keep using heat pipes galaxy s9 note9Meanwhile, smartphone brand vendors are also trying out vapor chambers for heat dissipation, but have so far not yet placed any orders. Since vendors’ demand for heat dissipation is expected to rise as they add more new functionalities into their smartphones, the sources believe there is a high chance for smartphone brands to adopt vapor chambers in 2019.

While the report points out that vapor chambers will likely be more expensive than heat pipes when they do arrive, this is thought to still be a more appealing option due to their increased ability at dissipating heat. Which inherently will make them much safer options in the long-term.

Demand for vapor chambers from notebook vendors have been picking up in the past few years due to increasing shipments of ultra-thin gaming notebooks and the adoption has started expanding to non-gaming ultra-thin models(e.g. the 10.9mm thick Asus ZenBook Flip S).

In addition to costs, the size of vapor chambers is also a major holdback for smartphone vendors to considering adopting the component. However, related makers have been pushing to reduce the thickness of vapor chamber and are currently able to roll out 0.4mm thickness products.

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